In Stock
Bola Reballing BGA Mekanik 0.2/0.25/0.3/0.35/0.4/0.45/0.5/0.55/0.6/0.65/0.76Mm untuk Perbaikan Ulang BGA
Rp112.150
Description
BGA Reballing Bola 0.2/0.25/0.3/0.35/0.4/0.45/0.5/0.55/0.6/0.65/0.76mm Timah Solder Bola Untuk BGA ulang Perbaikan
Paket:
1 botol * 0.2/0.25/0.3/0.35/0.4/0.45/0.5/0.55/0.6/0.65/0.76mm Solder







Specifications
Asal | CN (Asal) |
Bahan | Tin |
Aplikasi | Circuit boards welding |
Diameter | 0.2/0.25/0.3/0.35/0.4/0.45/0.5/0.55/0.6/0.65/0.76mm |
Application | Mobile Phone Repair Tools |
Nomor Model | solder tin |
Sertifikasi | NONE |